The CUPP Series has become a standard in the European relay market due to its versatile switch and schematic options. The staggered pin layout gives more space and allows for higher isolation from pin to pin on the PC board when compared to 1.0” x 0.1” relays. Designers have a choice between two switch technologies: ruthenium sputtered dry reed and the vertically mounted high performance Hg wetted contact.
Note: Relays with Hg Wetted option must be mounted vertically ±30˚
All parameters are measured at 25°C unless otherwise stated.
Storage Temp: -40°C to +105°C; Operating Temp: -38°C to +85°C; Solder Temp: 270°C max; 10 sec. max
All electrical parameters measured at 25°C unless otherwise specified.
Vibration: 20 G’s to 2000 Hz; Shock: 50 G’s